Ion trapping (IXE® and IXEPLAS®)
The disadvantages of conventional organic ion exchange resins are low heat resistance and poor resistance to organic solvents. While clay minerals and zeolite have long been known as inorganic ion exchangers, they have disadvantages of poor reproducibility of functions and lack of water resistance.
IXE® is a series of inorganic ion exchangers which we industrialized for the first time in the world in order to overcome the disadvantages of conventional organic and inorganic ion exchangers.
Characteristics
IXE® is an ion-trapping agent with superior ion-trapping capacity and heat resistance properties. The reliability of electronics materials can be improved by adding this agent to sealing resin and the like.
- With superior heat resistance, the agent can be used at high temperatures of over 100°C.
- A high ion selectivity; specific ions can be trapped through co-existing ions.
- Effective even in conditions with almost no moisture.
- High resistance to radiation means no deterioration even under strong radiation.
- Superior resistance to organic chemicals and to melting resins.
- High resistance to oxidation, meaning it can be used in oxidizing environments.
Mechanism of IXE®/IXEPLAS
The reliability of electronics materials can be improved by adding this agent to trap impurity ions in sealants.
IXE® not added
IXE® added
Applications
- IC encapsulating material (EMC, liquid encapsulating material, and more)
- FPC Adhesives and Resist Inks
- Paints (coating film durability, improvement of rust resistance effects)
- Organic solvents, purification of monomers, etc.
IXEPLAS is an even higher-performance version of IXE®, our ion-trapping agent with superior ion-trapping capacity and heat resistance properties. In addition to increasing the reliability of sealing materials, it can also be used for advanced semiconductor packages which have been incompatible until now.
- Its primary particle size is sub-micron, and it can be used for underfill materials, narrow pitch sealants, and more.
- The fine particle size means that small quantities of the additive are highly effective.
- Has a copper and silver ion-trapping effect, making it ideal for copper bonding wire, sealing silver wiring, and more.
- Shows ion-trapping capability at a broad pH range because it is a dual ion exchanger.
- With minimal impurities, it has almost no negative effects on sealing materials.
- Contains no substances subject to the Restriction of Hazardous Substances (RoHS) Directive.
Mechanism of IXE®/IXEPLAS
Comparison between IXEPLAS and IXE®
IXEPLAS’ fine particle size makes it effective with smaller quantities of additive.
Conventional IXE® (1 to 2 μm)
It captures some, but not all, free Cl- ions.
IXEPLAS (0.2 to 0.5 μm)
With even a small amount of additive,
free Cl- ions are reliably captured.
Applications
- IC sealing material (EMC, liquid sealing material, underfill material, and die bonding)
- FPC Adhesives
- Solar battery materials and components (back sheet, sealing resin)
- Resist inks
- Conductive pastes, etc.
